Currently, oxidation reaction, poor wettability and high peak temperature in reflow soldering will do harm to electronic solder joints. To offset these effects, using nitrogen to inert the atmosphere during soldering has become a globally accepted practice in electronic assembly. Nitrogen atmosphere improves the wettability of solder, reduces the degree of oxidation, and accelerates the speed of soldering reaction.
Whatever you need to control the atmosphere within your reflow ovens and simultaneously decrease nitrogen costs, Nexelia™ for Reflow Soldering is the unrivalled option.
A comprehensive gas solution designed for and adapted to your specific needs, Nexelia™ for Reflow Soldering combines the best of our gases, application technologies and expert support. As with all solutions under the Nexelia™ label, we work closely with you to pre-define a concrete set of results, and we commit to delivering them.
A complete retrofit solution, Nexelia™ for Reflow Soldering was expertly designed by Air Liquide to generate and carefully monitor inert atmosphere into your reflow oven. The solution combines nitrogen supply with an automated controlling system to automatically adjust the inert atmosphere composition in the reflow oven.
Your benefits of Nexelia™ for Reflow Soldering:
optimization of nitrogen consumption,
saving on energy costs,
continuous quality monitoring of reflow atmosphere for optimal soldering,
simplified management thanks to a completely automated control system,
up to 70 ton/year of CO2 emissions reduction.
For optimal reflow soldering, Air Liquide provides you the following equipment:
ECO NITROREFLOW: a patented, automatic control system designed by Air Liquide for the cautious monitoring of inert atmosphere into your reflow oven.